By John H. Lau ... [et al.]
Advent to MEMS --
Advanced MEMS packaging --
Enabling applied sciences for complex MEMS packaging --
Advanced MEMS wafer-level packaging --
Optical MEMS packaging : communications --
Optical MEMS packaging : bubble swap --
Optical MEMS : microbolometer packaging --
Bio-MEMS packaging --
Biosensor packaging --
Accelerometer packaging --
Radiofrequency MEMS switches --
RF MEMS tunable capacitors and tubable band-pass filters --
Advanced packaging of RF MEMS units
Read or Download Advanced MEMS packaging PDF
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Additional resources for Advanced MEMS packaging
Microelectromechanical systems, and methods for encapsualting and fabricating same,” Partridge, Aaron (US), Lutz, Markus (US) (+1), US2008237756 (A1)—2008-10-02. 25. “Functional device,” Hata, Shohei (JP), Sakamoto, Eiji (JP) (+1), US2008233349 (A1)—2008-09-25. 26. , Elasser, Ahmed (+4), JP2008198607 (A)—200808-28. 27. “MEMS fiber optic microphone,” Chin, Ken K. (US), Feng, Guanhua (US) (+1), WO2008100266 (A2)—2008-08-21. 28. “Apparatus for driving micromechanical devices,” Miles, Mark W. (US), US2008191978 (A1)—2008-08-14.
124. “Electronic parts packaging structure and method of manufacturing the same,” Sunohara, Masahiro (JP), Higashi, Mitsutoshi (JP), US2006246630 (A1)—2006-11-02. 125. “Apparatus for packaging MEMS element and method thereof,” Jang, Hyuk Kyoo (KR), Noh, Seung Jeong (KR) (+3), KR20060061044 (A)—2006-06-07. 126. “Pizoelectric rf MEMS switch using wafer unit packaging and microfabrication technology and fabrication method thereof,” Park, Jae Hyoung (KR), Lee, Hee Chul (KR) (+1), KR20060022561 (A)—2006-03-10.
Fan, Chun Ho (Sham Tseng, HK), Labeeb, Sadak Thamby (Tsuen Wan, HK), Chow, Lap Keung (Kowloon, HK), “Sensor semiconductor package and method of manufacturing the same,” January 3, 2006. Pleskach, Michael David (Orlando, FL), Koeneman, Paul Bryant (Palm Bay, FL), Smith, Brian Ronald (Pittsburgh, PA), Newton, Charles Michael (Palm Bay, FL), Gamlen, Carol Ann (Melbourne, FL), “Electro-fluidic device and interconnect and related methods,” December 6, 2005. Patel, Satyadev R. (Sunnyvale, CA), Huibers, Andrew G.
Advanced MEMS packaging by John H. Lau ... [et al.]